A laser is used to print the lot number (such as ABC1234) of the wafer directly above the wafer to ensure the traceability of the entire process chain. This lot number is arranged by many recessed holes, a byproduct of marking It will accumulate around the pits. Excessive or hard protrusions may scratch the surface of the wafer in the later process and cause the wafer to be scrapped. Ultraviolet laser processing is a cold processing method that can better solve the problem of accumulation. It is an ideal wafer marking program.
- Automatically wafer pick-up from the magazine
- Finding wafer automatically with edge seeker
- Automatic positioning marking with the visual system
- The visual inspection system is available
- Available to mark on the backside of the wafer through the transmittance film
- Comply with customer MES data
- SMIF and other automatic loading and unloading modules are selectable
- UV and Green laser modules can be selected upon to the demand
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