wafer laser marking system

home page>Products>MICROMACHINING SYSTEMS>Wafer Laser Marking System

RETURN

Wafer Laser Marking System

Wafer laser marking machine.
Laser marking is widely used in the semiconductor industry due to its apparent advantages, such as high marking accuracy, fast speed, and permanent marking.
Wafer marking on the die requires good marking quality. High cleanliness levels will ensure traceability and reliability.

Features

A laser is used to print the lot number (such as ABC1234) directly above the wafer to ensure the entire process chain's traceability. This lot number is composed of many recessed holes. There may be some derivatives after marking, which will accumulate around the pits. Excessive or hard protrusions may scratch the wafer's surface in the later process and cause the wafer to be scrapped. Ultraviolet laser processing is a cold processing method that solves accumulation, making it an ideal wafer marking program.

- Automatic wafer pick-up from the magazine

- Finding wafers automatically with edge seeker

- Automatic positioning marking with the visual system

- The visual inspection system is available

- Available to mark on the backside of the wafer through the transmittance film

- Complies with the SMEMA standard

- SMIF and other automatic loading and unloading modules can be selected as an extension

- UV and Green laser modules can be selected upon to the demand

______________________________________________________________________________________

Application and Samples

6-inch, 8-inch, 12-inch wafer front or back marking

Technical Specs

Laser Type	UV Laser
Wavelength	355 nm
Min Beam Diameter	< 10 µm
Beam Quality M2	< 1.2
Pulse Frequency	10 - 200 kHz
Output Power	10 Watts
Repetition Accuracy	2 μm
Cooling System	Water-cooled
Fθ Marking Field Size	1.96" x 1.96" (50mm x 50mm)
X, Y travel Distance	15.74" x 11.81" (400mm x 300 mm)
Laser Safety Level	Class I
Electrical Connection	110 - 230 V (± 10%) 20 A, 50/60 Hz
Power Consumed	5 Kw
Warranty Coverage(Parts & Labor)	1-year
Laser Safety Compliance	FDA(CDRH)
Running Temperature	15℃-35℃ / 59°-95°F

Options and Accessories

SMIF, other automatic loading and unloading modules