A laser is used to print the lot number (such as ABC1234) directly above the wafer to ensure the entire process chain's traceability. This lot number is composed of many recessed holes. There may be some derivatives after marking, which will accumulate around the pits. Excessive or hard protrusions may scratch the wafer's surface in the later process and cause the wafer to be scrapped. Ultraviolet laser processing is a cold processing method that solves accumulation, making it an ideal wafer marking program.
- Automatic wafer pick-up from the magazine
- Finding wafers automatically with edge seeker
- Automatic positioning marking with the visual system
- The visual inspection system is available
- Available to mark on the backside of the wafer through the transmittance film
- Complies with the SMEMA standard
- SMIF and other automatic loading and unloading modules can be selected as an extension
- UV and Green laser modules can be selected upon to the demand