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Wafer Laser Marking System HDZ-WAF600
 
Laser marking is widely used in the semiconductor industry due to its apparent advantages such as high marking accuracy, fast speed, and permanent marking. 
Wafer marking on the die with good marking quality, high cleanliness levels, ensure the traceability and reliability. 
   

 
Features
 
● Automatically wafer pick-up from the magazine
● Finding wafer automatically with edge seeker 
● Automatic positioning marking with the visual system
● The visual inspection system is available
● Available to mark on the backside of the wafer through the transmittance film 
● Comply with customer MES data
● SMIF and other automatic loading and unloading modules are selectable
● UV and Green laser modules can be selected upon to the demand
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Wafer Laser Marking System HDZ-WAF600

Laser marking is widely used in the semiconductor industry due to its apparent advantages such as high marking accuracy, fast speed, and permanent marking. 
Wafer marking on the die with good marking quality, high cleanliness levels, ensure the traceability and reliability. 

Features

● Automatically wafer pick-up from the magazine
● Finding wafer automatically with edge seeker 
● Automatic positioning marking with the visual system
● The visual inspection system is available
● Available to mark on the backside of the wafer through the transmittance film 
● Comply with customer MES data
● SMIF and other automatic loading and unloading modules are selectable
● UV and Green laser modules can be selected upon to the demand
    

 

Application and Samples
Apply to 6-inch, 8-inch, 12-inch wafer front or back marking.
Options and Accessories
SMIF and other automatic loading and unloading modules are selectable.
Technical Specs
 
Laser Type UV Laser
Wavelength 355 nm 
Min Beam Diameter  < 10 µm
Beam Quality M2  < 1.2
Pulse Frequency 10 - 200 kHz
Output Power 10 Watts
Repetition Accuracy 2 μm
Cooling System Water-cooled
Fθ Marking Field Size 1.96" x 1.96"
(50mm x 50mm)
X, Y travel Distance 15.74" x 11.81"(400mm x 300 mm)
Laser Safety Level Class I
Electrical Connection 110 - 230 V (± 10%) 20 A,
50/60 Hz
Power Consumed 5 Kw
Warranty Coverage
(Parts & Labor)
1-year
Laser Safety Compliance FDA(CDRH)
Running Temperature
15℃-35℃ / 59°-95°F