- Small heat-affected zone, it can achieve high-quality processing
- Wide applicable materials range can compensate for the shortage of infrared laser processing ability
- With good beam quality and a small focusing spot, it can achieve superfine marking
- High marking speed, high efficiency, and high precision
- No consumables, low cost and low maintenance fee
- The overall machine has stable performance, supporting the long-term operation
- Green laser marking of electronic product's LOGO, model, place of origin
- Green laser marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤50μm
- PCB laser marking, PCB laser depaneling, PCB laser singulation
- Removal of metal or non-metallic coatings
- Silicon wafer micro-hole and blind hole laser processing
- Laser marking of low-voltage apparatus and refractory materials