The UV laser is 355 nm wavelength, with a "cold marking" method, the laser beam diameter is only 20 μm after focusing, the UV laser's pulse energy comes in contact with the material in the microsecond. There is no significant thermal influence next to the slit, so no heat damages the electronic component.
UV Laser is suitable for rigid and flexible substrate cutting and marking, like FR4 substrates and imitation resin-based materials, polyimide, ceramics, PTFE, polyester, aluminum, brass, and copper, etc.
- UV laser processing is non-contact processing, stress-free, and will not deform the board
- It will not produce dust, the cutting edges are smooth and tidy, and there will be no burrs
- PCBA processing is achievable
- Any graphics can be processed by Han's Laser specified software
- Capable of making FPC, Rigid printed circuit board laser singulation
- A two-dimensional linear moving stage and high-resolution CCD guarantees high accuracy and precision
- The cutting capacity of the machine is up to 0.004" to 0.07" thickness
- Able to mark 1D, 2D barcode, GS1 code, Series numbers
- X-out marking is available as an optional extension
- Selectable working field size and laser power to meet specific demand
- Complies with the SMEMA standard
Click the link below to see our fully automated system design.