Home About Products Application Laser Knowledge Contact Us
Contact us
 

PCB Laser Depaneling Machine HDZ - UVC3030
 
The UV  laser depaneling machine is assembled with state-of-the-art 355nm Draco laser module. Optimum UV technology ensures the consistent good cutting quality on the fiberglass material (FR4) and flexible PCBs, the cold working method produces small heat-affected zone(HAZ), minimize the charring, and make minimal mechanical and thermal stress, distortion-free.
 
SW control makes all complex contour can be quickly processed, no die cost, user-friendly software support a quick parameter setting to get a clean cut without damage substrate and components of the PCBA.
 
2D bar code and Serial number marking are able to be marked with the machine.
 
A turn-key design, a combination of reliability, high performance, and  low running cost.
 
Contact us for more information.
 
 
Features:
 
● A two-dimensional linear moving stage and high-resolution CCD guarantee high accuracy and precision
● The cutting capacity of the machine is up to 0.004" to 0.07" thickness
● Able to mark 1D, 2D barcode, GS1 code, Series numbers
● Comply with SMEMA standard
 

PCB Laser Depaneling Machine HDZ - UVC3030
 
The UV  laser depaneling machine is assembled with state-of-the-art 355nm Draco laser module. Optimum UV technology ensures the consistent good cutting quality on the fiberglass material (FR4) and flexible PCBs, the cold working method produces small heat-affected zone(HAZ), minimize the charring, and make minimal mechanical and thermal stress, distortion-free.
 
SW control makes all complex contour can be quickly processed, no die cost, user-friendly software support a quick parameter setting to get a clean cut without damage substrate and components of the PCBA.
 
2D bar code and Serial number marking are able to be marked with the machine.
 
A turn-key design, a combination of reliability, high performance, and  low running cost.
 
Contact us for more information.
 
 
Features:
 
● A two-dimensional linear moving stage and high-resolution CCD guarantee high accuracy and precision
● The cutting capacity of the machine is up to 0.004" to 0.07" thickness
● Able to mark 1D, 2D barcode, GS1 code, Series numbers
● Comply with SMEMA standard

Application and Samples
● Rigid FR4, Flexible Printed circuit boards (PCBs)
● Glass substrates
● Ceramic
UV laser depaneling
UV laser depaneling
UV laser depaneling
UV laser depaneling
UV laser depaneling
UV laser depaneling
UV laser depaneling
UV laser depaneling
Options and Accessories
We have mature options and accessories to fit your specific application. A custom solution is always welcomed to consult.
Technical Specs
 
Laser Type UV Laser
Wavelength 355 nm 
Min Beam Diameter  < 10 µm
Beam Quality M2  < 1.2
Pulse Frequency 10 - 200 kHz
Output Power 15 Watts
Repetition Accuracy 3 μm
Cooling System Water-cooled
Fθ Marking Field Size 1.96" x 1.96"
(50mm x 50mm)
X, Y travel Distance 15.74" x 11.81"(400mm x 300 mm)
Laser Safety Level Class I
Electrical Connection 110 - 230 V (± 10%) 16 A,
50/60 Hz
Power Consumed 6 Kw
Dimensions 41.73" x 39.37" x 72.83" (1060mm x 1000mm x 1850mm)
Warranty Coverage
(Parts & Labor)
1-year
Laser Safety Compliance FDA(CDRH)
Running Temperature
15℃-35℃ / 59°-95°F