In the process of making the PCB board, when the electronic components inserted on the PCB board are tested to be defective, they need to be removed and replaced with a good product. Before replacing a good product, remove the glue that sticks to the defective product on the PCB. The traditional method Manual grinding or scraping is used, which is time-consuming, laborious and insufficient removal, and the yield of PCB boards after this processing method is not high.
The laser glue removal method is environmentally friendly, no chemical pollution, fast processing speed, it can greatly improve production efficiency.
- Dual intelligent vision CCD systems are used for the edge of the board and fiducial recognization
- The heat affected zone and material deformation are small
- Assemble with X, Y, Z three-axis high accuracy working table
- Low running cost, an ideal alternative solution to replace hand removal
- The software supports Serial Port and TCP/IP communication with the client-server