When the electronic components are inserted onto the PCB board identified as defective, they need to be removed and replaced with a functioning product. Before that, the glue stuck to the defective product needs to be removed. The traditional method of manual grinding or scraping is used, which is time-consuming, laborious, and the yield of PCB boards after this processing method is not high.
The laser glue removal method is environmentally friendly, has no chemical pollution, fast processing speed, and improved production efficiency.
- Dual intelligent vision CCD systems are used for the edge of the board and fiducial recognition
- The heat-affected zone and material deformation are small
- Assemble with X, Y, Z three-axis high accuracy working table
- Low running cost, an ideal alternative solution to replace hand removal
- The software supports Serial Port and TCP/IP communication with the client-server
Laser Type | UV De-coating |
Wavelength | 355 nm |
Min Beam Diameter | < 10 µm |
Beam Quality M2 | < 1.2 |
Pulse Frequency | 10 - 200 kHz |
Output Power | 4 Watts |
Repetition Accuracy | ± 0.0001'' (0.003mm) |
Cooling System | Water-cooled |
Vision System | high-performance CCD camera |
Operation System | WINDOWS 7 /10 |
Laser Safety Level | Class I |
Electrical Connection | 110 - 230 V (± 10%) 16 A,50/60 Hz |
Power Consumed | 2 kW |
Warranty Coverage(Parts & Labor) | 1- year |
Laser Safety Compliance | FDA(CDRH) |
Running Temperature | 15℃-35℃ / 59°-95°F |