The UV laser marking machine uses a 355 nm wavelength UV laser with a "cold marking" method. The laser beam diameter is only 20 μm after focusing. The UV laser's pulse energy comes in contact with the material in the microsecond, and there is no significant thermal influence next to the slit, so no heat damages the electronic component.
- With cold laser processing and a small heat-affected zone, it can achieve high-quality processing
- Wide applicable materials range can compensate for the shortage of the infrared laser processing ability
- With good beam quality and a small focusing spot, it can achieve superfine marking
- High marking speed, high efficiency, and high precision
- No consumables, low cost, and low maintenance fee
- The overall machine has stable performance and supporting the long-term operation
- The double-station rotary table supports simultaneous work of loading and unloading and laser processing.
Machine Type | EP-15-THG-D |
Wavelength | 355nm |
Marking Speed | 250 characters per second |
Type of Cooling | Water-Cooling |
Mark the Minimum Line Width | 10μm - 15μm |
Laser Power | 4KW / 7KW / 10KW / 15KW / 25KW |
Marking Field Size | 100mm*100mm |
The Standard Lens | F160 |
Laser Safety Level | Class I |
Electrical Connection | 220V 16A, 50 Hz |
Power Consumed | 1.5Kw - 2Kw |
Dimensions | 800mm x 950mm x 1630mm |
Warranty Coverage | 1-year |