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Laser Depaneling PCB Machine HDZ - UVC3030
The UV laser depaneling machine is assembled with state-of-the-art 355nm Draco laser module. Optimum UV technology ensures the consistent good cutting quality on the fiberglass material (FR4) and flexible PCBs, the cold working method produces small heat-affected zone(HAZ), minimize the charring, and make minimal mechanical and thermal stress, distortion-free.
SW control makes all complex contour can be quickly processed, no die cost, user-friendly software support a quick parameter setting to get a clean cut without damage substrate and components of the PCBA.
2D bar code and Serial number marking are able to be marked with the machine.
A turn-key design, a combination of reliability, high performance, and low running cost.
Contact us for more information.
Features:
● A two-dimensional linear moving stage and high-resolution CCD guarantee high accuracy and precision
● The cutting capacity of the machine is up to 0.004" to 0.07" thickness
● Able to mark 1D, 2D barcode, GS1 code, Series numbers
● Comply with SMEMA standard
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Laser Depaneling PCB Machine HDZ - UVC3030
The UV laser depaneling machine is assembled with state-of-the-art 355nm Draco laser module. Optimum UV technology ensures the consistent good cutting quality on the fiberglass material (FR4) and flexible PCBs, the cold working method produces small heat-affected zone(HAZ), minimize the charring, and make minimal mechanical and thermal stress, distortion-free.
SW control makes all complex contour can be quickly processed, no die cost, user-friendly software support a quick parameter setting to get a clean cut without damage substrate and components of the PCBA.
2D bar code and Serial number marking are able to be marked with the machine.
A turn-key design, a combination of reliability, high performance, and low running cost.
Contact us for more information.
Features:
● A two-dimensional linear moving stage and high-resolution CCD guarantee high accuracy and precision
● The cutting capacity of the machine is up to 0.004" to 0.07" thickness
● Able to mark 1D, 2D barcode, GS1 code, Series numbers
● Comply with SMEMA standard
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Application and Samples
Laser depanel different kinds of substrates,such as
● Rigid, Flexible Printed circuit boards (PCBs) and PCBA.
● Copper substrates
● Rigid, Flexible Printed circuit boards (PCBs) and PCBA.
● Copper substrates
UV laser depaneling
UV laser depaneling
UV laser depaneling
UV laser depaneling
UV laser depaneling
UV laser depaneling
UV laser depaneling
UV laser depaneling
Options and Accessories
Technical Specs
| Laser Type | UV Laser |
| Wavelength | 355 nm (nominal) |
| Min Beam Diameter | < 10 µm |
| Beam quality M2 | < 1.2 |
| Pulse Frequency | 10 - 200 kHz |
| Output Power | 15 Watts |
| Repetition accuracy | 3 micron |
| Cooling System | Fully water cooled |
| Fθ Marking Field Size | 50mm x 50mm |
| X, Y travel distance | 400mm x 300 mm |
| Laser Safety level | Class I |
| Electrical Connection |
110 - 230 V (± 10%) 16 A, 50/60 Hz |
| Power consumed | 6 KW |
| Dimensions | 1060mm x 1000mm x1850mm |
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Warranty Coverage (Parts & Labor) |
As Quoted |
| Laser Safety Compliance | FDA |
| Running temperature |
15℃-35℃ |
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