UV Laser Depaneling Machine HDZ-UVC3030 for PCBA processing

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Laser Depaneling PCBA Machine HDZ- UVC3030

Laser de-paneling machine for PCBA and related industry.
The UV laser depaneling machine is assembled with state-of-the-art 355nm Draco laser module. Optimum UV technology ensures the consistent good cutting quality on the fiberglass material (FR4) and flexible PCBA, the cold working method produces small heat-affected zone(HAZ), minimize the charring, and make minimal mechanical and thermal stress, distortion-free.
SW control makes all complex contour can be quickly processed, no die cost, user-friendly software support a quick parameter setting to get a clean cut without damage substrate and components of the PCBA.

2D bar code and Serial number marking are able to be marked with the machine.
A turn-key design, a combination of reliability, high performance, and low running cost.

Features

The UV laser is 355 nm wavelength, with a "cold marking" method,the laser beam diameter is only 20 μm after focusing, The pulse energy of the UV laser act on the material is in microsecond, and there is no significant thermal influence next to the slit, so there is no damage to the electronic component caused by the heat generated.

UV Laser is suitable for rigid, flexible and rigid&flexible substrate cutting and marking, like FR4 substrates and imitation resin-based materials, polyimide, ceramics, PTFE, polyester, aluminum, brass and copper, etc.

- UV laser processing is non-contact processing, stress-free, and will not deform the board

- It will not produce dust, the cutting edges are smooth and tidy, and there will be no burrs

- PCBA boards with components (PCBA) can be processed

- Any graphics can be can be processed by Han's Laser specified software

- Capable to make FPC, Rigid printed circuit board laser singulation

- A two-dimensional linear moving stage and high-resolution CCD guarantee high accuracy and precision

- The cutting capacity of the machine is up to 0.004" to 0.07" thickness

- Able to mark 1D, 2D barcode, GS1 code, Series numbers

- X-out marking is optional to get

- Selectable working field size and laser power to meet specific demand

- Comply with SMEMA standard

Application and Samples

- Rigid FR4, Flexible Printed circuit boards, PCBA

- Glass substrates

- Ceramic

Laser Depaneling PCBA

Laser Depaneling

Laser Depaneling PCBA

Technical Specs

Laser Type	UV Laser
Wavelength	355 nm
Min Beam Diameter	< 10 µm
Beam Quality M2	< 1.2
Pulse Frequency	10 - 200 kHz
Output Power	15/20 Watts
Repetition Accuracy	3 μm
Cooling System	Water-cooled
Fθ Marking Field Size	1.96" x 1.96"(50mm x 50mm)
X, Y travel Distance	15.74" x 11.81"(400mm x 300 mm)
Laser Safety Level	Class I
Electrical Connection	110 - 230 V (± 10%) 16 A,50/60 Hz
Power Consumed	6 Kw
Dimensions	41.73" x 39.37" x 72.83" (1060mm x 1000mm x 1850mm)
Warranty Coverage(Parts & Labor)	1-year
Laser Safety Compliance	FDA(CDRH)
Running Temperature	15℃-35℃ / 59°-95°F

Options and Accessories