The UV laser is 355 nm wavelength, with a "cold marking" method,the laser beam diameter is only 20 μm after focusing, The pulse energy of the UV laser act on the material is in microsecond, and there is no significant thermal influence next to the slit, so there is no damage to the electronic component caused by the heat generated.
UV Laser is suitable for rigid, flexible and rigid&flexible substrate cutting and marking, like FR4 substrates and imitation resin-based materials, polyimide, ceramics, PTFE, polyester, aluminum, brass and copper, etc.
- UV laser processing is non-contact processing, stress-free, and will not deform the board
- It will not produce dust, the cutting edges are smooth and tidy, and there will be no burrs
- PCBA boards with components (PCBA) can be processed
- Any graphics can be can be processed by Han's Laser specified software
- Capable to make FPC, Rigid printed circuit board laser singulation
- A two-dimensional linear moving stage and high-resolution CCD guarantee high accuracy and precision
- The cutting capacity of the machine is up to 0.004" to 0.07" thickness
- Able to mark 1D, 2D barcode, GS1 code, Series numbers
- X-out marking is optional to get
- Selectable working field size and laser power to meet specific demand
- Comply with SMEMA standard