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Laser Depaneling PCBA Machine HDZ- UVC3030

Laser de-paneling machine for PCBA and related industry.
A turn-key design. The UV laser depaneling machine is assembled with a state-of-the-art 355nm Draco laser module, with fine-tuning, which ensures consistent, high-quality cutting on the fiberglass material (FR4) and flexible PCBA. The cold working method produces small heat-affected zones(HAZ), minimizes the charring, and makes minimal mechanical and thermal stress, distortion-free.
SW control can quickly process any complex contours, no die cost, equipped with user-friendly software support with a quick parameter setting that produces a clean cut without damaging the substrate and components of the PCBA.
A 2D bar code and serial numbers can be marked with the machine.

Features

The UV laser is 355 nm wavelength, with a "cold marking" method, the laser beam diameter is only 20 μm after focusing, the UV laser's pulse energy comes in contact with the material in the microsecond. There is no significant thermal influence next to the slit, so no heat damages the electronic component.

UV Laser is suitable for rigid and flexible substrate cutting and marking, like FR4 substrates and imitation resin-based materials, polyimide, ceramics, PTFE, polyester, aluminum, brass, and copper, etc.

- UV laser processing is non-contact processing, stress-free, and will not deform the board

- It will not produce dust, the cutting edges are smooth and tidy, and there will be no burrs

- PCBA processing is achievable

- Any graphics can be processed by Han's Laser specified software

- Capable of making FPC, Rigid printed circuit board laser singulation

- A two-dimensional linear moving stage and high-resolution CCD guarantees high accuracy and precision

- The cutting capacity of the machine is up to 0.004" to 0.07" thickness

- Able to mark 1D, 2D barcode, GS1 code, Series numbers

- X-out marking is available as an optional extension

- Selectable working field size and laser power to meet specific demand

- Complies with the SMEMA standard

Click the link below to see our fully automated system design.

A Fully Automated System of PCBs Laser Depaneling, Sorting and Stacking

Application and Samples

- Rigid FR4, Flexible printed circuit boards, PCBA

- Glass substrates

- Ceramic

Laser Depaneling PCBA

Laser Depaneling

Laser Depaneling PCBA

Technical Specs

Laser Type	UV Laser
Wavelength	355 nm
Min Beam Diameter	< 10 µm
Beam Quality M2	< 1.2
Pulse Frequency	10 - 200 kHz
Output Power	15/20 Watts
Repetition Accuracy	3 μm
Cooling System	Water-cooled
Fθ Marking Field Size	1.96" x 1.96"(50mm x 50mm)
X, Y travel Distance	15.74" x 11.81"(400mm x 300 mm)
Laser Safety Level	Class I
Electrical Connection	110 - 230 V (± 10%) 16 A,50/60 Hz
Power Consumed	6 Kw
Dimensions	41.73" x 39.37" x 72.83" (1060mm x 1000mm x 1850mm)
Warranty Coverage(Parts & Labor)	1-year
Laser Safety Compliance	FDA(CDRH)
Running Temperature	15℃-35℃ / 59°-95°F

Options and Accessories