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Solar Power


Silicon wafer slicer is mainly applied in the solar battery industry and the semiconductor industry. The laser is able to slice, cut or groove on the surfaces of silicon, polysilicon, germanium and gallium arsenide etc. The technology will not damage any side of the silicon, and the performance of the product. As a result, the manufacturing efficiency, as well as production efficiency, is greatly improved.


Before cutting   After cutting


G20 Fiber Laser         Fiber Series KS20         UV-3C

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